Huawei facility O&M methods emphasize using monitored operating data to locate inefficiencies before they become faults. Airflow-related cooling inefficiency commonly appears as hot spots at rack inlets, elevated return air temperature fluctuations, abnormal fan speed increases, or uneven temperature distribution across aisles. By trending rack inlet temperature sensors alongside cooling unit supply/return temperatures and fan speed or airflow commands, operations teams can distinguish between insufficient cooling capacity and poor airflow organization. Recirculation (hot air returning to rack inlets) often raises localized inlet temperatures without a proportional rise in room average temperature, while bypass (cold air short-circuiting back to returns) reduces cooling effectiveness and can drive fans to higher speeds unnecessarily. Data-driven checks support targeted corrective actions such as sealing cable openings, adjusting floor tile placement, restoring containment integrity, balancing airflow, or optimizing setpoints. This approach improves thermal stability, prevents overcooling, reduces energy waste, and aligns with Huawei's emphasis on integrated monitoring and closed-loop optimization for reliable, efficient operation.